xMEMS Enters Mass Production with µCooling Solid-State Active Cooling Chips
xMEMS has officially entered mass production with its µCooling solid-state active cooling chips, launching two sizes: the medium XMC-2400 and the large XMC-4800. These chips utilize piezoelectric ultrasonic technology to deliver high-performance thermal management for mobile and edge AI devices. This breakthrough replaces traditional bulky cooling fans with a thin, silicon-based solid-state solution, enabling next-generation edge AI hardware like smart glasses and smartphones to run at peak performance without overheating. It addresses critical thermal bottlenecks in compact form factors. The µCooling chips measure just 1.13mm in thickness and feature an IP68 dust and water resistance rating. The XMC-2400 delivers a 28ml/s flow rate for XR glasses, while the XMC-4800 provides a 48ml/s flow rate suitable for smartphones and enterprise SSDs.
## BACKGROUND
Solid-state active cooling replaces traditional mechanical fans with microscopic electronic structures, such as piezoelectric membranes, to generate air movement without rotating parts. MEMS (Micro-Electro-Mechanical Systems) technology integrates mechanical elements and electronics on a silicon substrate, allowing for ultra-compact thermal solutions.