Xiaomi Unveils Xuanjie Chip Lineup: O3 SoC, O100 AI Accelerator, and D100 Smart Driving Chip
Xiaomi has announced its new Xuanjie chip lineup, featuring the mass-produced O3 flagship SoC, the O100 3D-stacked AI accelerator, and the D100 3nm smart driving chip. The O3 has already entered mass production, while the O100 and D100 have completed development and are scheduled for commercial use next year. This milestone showcases Xiaomi's growing capabilities in in-house semiconductor design, spanning mobile devices, AI hardware, and autonomous driving. By developing its own high-performance silicon, Xiaomi aims to strengthen its "Human x Car x Home" ecosystem and reduce reliance on external chipmakers. The Xuanjie O3 features a 10-core all-big-core CPU design and is the first SoC to surpass 5 million points on AnTuTu. Meanwhile, the O100 is the industry's first 6nm 3D wafer-level stacked AI chip offering 1.22TB/s bandwidth, and the D100 is China's first domestic 3nm high-computing-power smart driving AI chip.
## BACKGROUND
Xiaomi has been steadily expanding its in-house chip design efforts, previously debuting the 3nm Xuanjie O1 mobile processor. Technologies like 3D wafer-level stacking allow multiple silicon dies to be vertically integrated using through-silicon vias (TSVs), significantly boosting bandwidth and performance for AI workloads without relying solely on traditional physical scaling.