Xiaomi Unveils Xuanjie AI Chip Prototypes for Edge and Supercomputing Terminals

Xiaomi CEO Lei Jun detailed two prototype devices powered by the next-generation Xuanjie AI chips: the O100 edge AI terminal achieving 295 tokens/s, and the AI Cube personal supercomputing terminal with 80GB unified memory. The Xuanjie O3 chip will debut on the Xiaomi 18 Fold, while the O100 and D100 chips are slated for commercialization in 2027. This marks a significant step in Xiaomi's custom silicon strategy, enabling high-performance, low-latency AI processing directly on edge devices. By running massive 120B parameter models locally, Xiaomi reduces reliance on cloud-based AI, enhancing privacy and performance in its ecosystem. The O100 prototype uses dual O3 and O100 chips with active air cooling up to 10W to run the Xiaomi MiMo model. The AI Cube integrates O3, O100, and D100 chips, supporting a 150W power release and a dual-system setup that switches between a 120B large model and a 3B edge model.