Xiaomi Unveils Three Self-Developed Xuanjie Chips, Including 3nm AI SoC and Smart Driving Chip

Xiaomi has officially unveiled three new self-developed chips: the Xuanjie O3 (a 3nm flagship AI SoC), the Xuanjie O100 (a high-bandwidth AI accelerator), and the Xuanjie D100 (a 3nm smart driving AI chip). All three chips have successfully completed tape-out verification, with the Xuanjie O3 set to debut on the upcoming Xiaomi 18 Fold smartphone. This release marks a significant milestone in China's domestic semiconductor design, showcasing Xiaomi's ability to develop advanced 3nm chips for mobile, automotive, and AI computing. It establishes a unified hardware foundation for Xiaomi's "Human x Car x Home" ecosystem, reducing reliance on external chipmakers. The Xuanjie O100 utilizes 6nm 3D wafer-level stacking advanced packaging to achieve a near-memory computing bandwidth of 1.22TB/s, while the D100 features a 20-core CPU. Xiaomi has invested over 21 billion RMB and dedicated a team of nearly 3,000 experts over five years to restart and achieve this breakthrough in large chip R&D.