Xiaomi Announces Xuanjie O100, the First 6nm 3D Wafer-Level Stacked AI Chip
Xiaomi has officially announced the Xuanjie O100, the industry's first 6nm 3D wafer-level stacked (Wafer-on-Wafer) AI acceleration chip designed for edge-side large language models. The chip has completed development and is scheduled for commercial release next year. This chip represents a major breakthrough in edge AI hardware, delivering an ultra-high bandwidth of 1.22TB/s (16 times that of traditional flagship smartphones) and inference speeds up to 330TPS. It could significantly accelerate the deployment of complex AI models directly on consumer devices. The Xuanjie O100 utilizes advanced hybrid bonding technology to achieve an industry-leading 1.4-micrometer bonding pitch. This 3D vertical stacking approach allows for massive bandwidth improvements without expanding the chip's physical footprint.
## BACKGROUND
Wafer-level packaging (WLP) is an advanced semiconductor manufacturing technique where integrated circuits are packaged directly on the silicon wafer before being diced into individual chips, reducing footprint and improving electrical performance. Hybrid bonding is a key 3D integration technology that directly bonds copper pads and dielectric surfaces of two wafers, enabling much higher interconnect density and bandwidth than traditional packaging methods.