US Announces Up to $389M for Semiconductor R&D Targeting Fusion and AI

The US Department of Commerce has announced plans to award up to $389 million to four companies under the CHIPS and Science Act for power semiconductor and advanced material research. The funding targets applications in nuclear fusion, AI data centers, and critical power infrastructure. This funding reflects the growing intersection of high-performance computing demands, AI data center power needs, and next-generation clean energy initiatives like nuclear fusion. By securing minority stakes in recipient companies, the government aims to strategically bolster domestic capabilities in critical hardware supply chains. Helion Energy is slated to receive the largest share at $175 million for high-voltage power semiconductors, while the remaining funds will support Commonwealth Fusion Systems, Vertical Semiconductor, and Sibelco. As a condition of the award, the US government will acquire non-voting minority equity stakes in the recipient entities.