Samsung to Outsource HBM Base Die Production to TSMC for Custom AI Memory
Samsung Electronics is reportedly adopting a dual-track strategy for its HBM memory business by partnering with TSMC to manufacture base dies for custom AI memory workloads. Certain customers have already begun designing HBM stack solutions combining Samsung's DRAM dies with TSMC-fabricated logic base dies. This represents a significant strategic pivot away from Samsung's traditional end-to-end internal supply chain toward open collaboration with its primary foundry competitor. By offering TSMC-manufactured base dies, Samsung can win over major AI chip designers who demand TSMC's logic nodes and packaging ecosystem for HBM4. Under the new strategy, Samsung will maintain its fully integrated in-house model for clients choosing Samsung base dies, while taking over internal design responsibility for clients opting for TSMC base dies. Transitioning HBM4 base dies to advanced foundry nodes allows host processors to offload specialized logic functions and integrate high-efficiency die-to-die interfaces.
## BACKGROUND
High Bandwidth Memory (HBM) stacks DRAM chips vertically over a bottom base die to deliver ultra-high bandwidth for AI computing. In earlier HBM generations, the base die was produced using standard memory manufacturing processes, but starting with HBM4, the base die is shifting to advanced logic process nodes to accommodate custom compute logic and complex inter-die connectivity.