Samsung and Qualcomm Develop 2.1D Advanced Packaging Using Organic Bridges
Samsung Electro-Mechanics and Qualcomm are collaborating to develop a 2.1D advanced packaging platform using embedded organic bridges for AI semiconductors. The two companies have conducted joint R&D and qualification on the technology for over a year. By substituting organic materials for silicon bridges, this approach reduces manufacturing costs compared to Intel's EMIB while bypassing Intel's proprietary patents. It enables chip designers like Qualcomm to produce high-bandwidth, multi-chip AI processors at a significantly lower price point. The organic bridge acts as a small substrate formed with 5–7 microcircuit layers using redistribution layer (RDL) processing. It targets 1.5–2µm line width/spacing, 4–5µm via sizes, and a pattern density of 500–1,000/mm, achieving higher routing density and I/O bandwidth than conventional FC-BGA substrates.
## BACKGROUND
Advanced packaging connects multiple semiconductor dies side-by-side or stacked in a single package to increase interconnect bandwidth and system performance for AI workloads. 2.1D packaging provides high-density interconnects using organic substrates and localized bridges rather than costly full-sized silicon interposers.