MediaTek Recruits Veteran Intel Executive for Advanced Packaging Strategy
MediaTek has recruited former Intel executive Navid Shahriari as senior vice president to lead its advanced packaging and design initiatives starting November 9. This follows the earlier appointment of former TSMC R&D vice president Douglas Yu as an advisor, as the company adopts a dual CoWoS and EMIB packaging strategy. This strategic hiring spree highlights MediaTek's aggressive push to capture a major share of the booming AI chip and application-specific integrated circuit (ASIC) market. By leveraging both TSMC's CoWoS and Intel's EMIB technologies, MediaTek aims to provide flexible, high-performance solutions for cloud providers. Shahriari brings 37 years of semiconductor experience, overseeing manufacturing operations, complex packaging, and data center product portfolios. MediaTek is reportedly collaborating with Intel on EMIB technology for cloud ASIC projects like Google TPU while simultaneously supporting TSMC's CoWoS.
## BACKGROUND
CoWoS (Chip on Wafer on Substrate) is a 2.5D packaging technology developed by TSMC that enables heterogeneous integration of processors and high-bandwidth memory (HBM). EMIB (Embedded Multi-die Interconnect Bridge) is Intel's proprietary packaging technology that bridges multiple semiconductor dies together efficiently inside a single package.