LG Electronics Invests 150 Billion KRW in US AI Data Center Chiller Plant
LG Electronics has announced a 150 billion KRW investment to build its third global AI data center chiller plant in Windsor, Virginia, while simultaneously expanding capacity at its Pyeongtaek and Changwon facilities in South Korea. The new 30,000-square-meter US facility will manufacture air-cooled chillers and is scheduled to begin production in the second half of 2027. Rapid growth in AI infrastructure has driven intense demand for high-capacity thermal management systems to handle massive heat loads from high-density GPU clusters. Localizing production in North America allows LG to secure a key position in the US supply chain as it scales its integrated cooling technologies. The Virginia plant will cover a total land site of 170,000 square meters and focus specifically on air-cooled AIDC chillers. This investment directly supports LG's full-stack 'chip-to-chiller' thermal architecture, which spans external chillers, coolant distribution units (CDUs), and direct cold plates.
## BACKGROUND
AI workloads require dense hardware configurations that produce far more thermal energy than standard computing infrastructure. Data center heat control relies on multi-tier thermal systems, where liquid cold plates absorb heat directly from processors, coolant distribution units (CDUs) manage fluid circulation, and large external chillers expel heat out of the facility.