HANMI Semiconductor Ships FC Bonder 75 for AI SoC 2.5D Advanced Packaging
HANMI Semiconductor announced the first shipment of its FC Bonder 75 flip-chip bonding machine designed for 2.5D advanced semiconductor packaging. The equipment supports package dimensions up to 75mm × 75mm, enabling the processing of large interposers for ultra-large AI SoCs. As AI processors grow rapidly in physical scale and complexity, semiconductor packaging requires specialized tools capable of handling larger surface areas and complex heterogeneous integration. HANMI's deployment strengthens the advanced packaging supply chain critical for scaling high-performance computing hardware. Alongside the FC Bonder 75, HANMI has introduced several packaging tools, including the FC Bonder 3.5, 2.5D TC Bonder 40 C2S, and 2.5D TC Bonder 40 C2W. The company is also preparing to launch the 2.5D TC Bonder 120, which will support package sizes up to 120mm × 120mm.
## BACKGROUND
Flip-chip bonding attaches semiconductor dies face-down onto substrates or interposers using microscopic conductive bumps rather than traditional wire bonding, enabling higher interconnect density and better thermal performance. In 2.5D advanced packaging, multiple silicon dies—such as compute units and high-bandwidth memory (HBM)—are placed side-by-side on an intermediate silicon layer (interposer) to allow ultra-fast data exchange.