GUC Tapes Out 16Gbps HBM4E IP on TSMC 2nm Process for AI ASICs
Global Unichip Corp. (GUC) announced the tape-out of its High Bandwidth Memory 4E (HBM4E) physical layer (PHY) and Controller IP built on TSMC's 2nm N2P process node. The IP achieves data transfer speeds of up to 16Gbps and has already been adopted for a customer's custom AI ASIC. High Bandwidth Memory is critical for overcoming memory bandwidth bottlenecks in next-generation AI accelerators. GUC's 16Gbps HBM4E IP enables custom ASIC designers to leverage TSMC's cutting-edge 2nm process and advanced packaging to maximize compute density and energy efficiency. The IP supports TSMC's 2.5D CoWoS-S/R/L advanced packaging and features a specialized face-up variant with integrated through-silicon vias (TSVs) designed for TSMC SoIC-X 3D integration. It is optimized for signal and power integrity, offering industry-leading power consumption and die area efficiency.
## BACKGROUND
High Bandwidth Memory (HBM) stacks DRAM dies vertically to deliver ultra-high data transfer rates to AI and high-performance computing processors. TSMC's CoWoS and SoIC are advanced 2.5D and 3D packaging technologies that interconnect multiple silicon chips closely together using interposers and direct vertical bonding to minimize signal delay and power loss.