GlobalFoundries and TSMC Sign $2B Deal for US Silicon Interposer Production
GlobalFoundries (GF) has signed a multi-year, $2 billion manufacturing agreement with TSMC to produce US-made silicon interposers for TSMC's CoWoS advanced packaging ecosystem. Under the deal, GF will expand its facility in Malta, New York, establishing the first silicon interposer production base in the United States. Silicon interposers are a critical component of advanced packaging, which currently serves as a key supply chain bottleneck for AI accelerators and high-performance computing (HPC) hardware. Building this production capacity in the US strengthens semiconductor supply chain resilience and helps fulfill the growing demand for next-generation AI infrastructure. Mass production ramp-up at GF's Malta facility is scheduled for the first half of 2028 under an initial five-year term that accommodates scalable expansion as customer demand grows. The site will support advanced packaging technologies, including components with embedded deep trench capacitors (DTC) for optimized power delivery and energy efficiency.
## BACKGROUND
CoWoS (Chip-on-Wafer-on-Substrate) is TSMC's proprietary 2.5D advanced packaging technology that connects high-bandwidth memory (HBM) and processing dies side-by-side on a silicon interposer. The silicon interposer features microscopic wiring and through-silicon vias (TSVs) that allow data to flow between chips with ultra-high bandwidth and low latency.