Frore Systems Launches LiquidJet Diamond Cold Plate with Integrated Diamond Vapor Chamber
Frore Systems has announced the LiquidJet Diamond, a liquid cooling cold plate that integrates a diamond wafer vapor chamber specifically designed to cover thermal hotspots on GPUs. Compared to the standard LiquidJet architecture, it reduces GPU hotspot temperatures by an extra 10°C and improves token energy efficiency by 10%. As modern AI chips consume over a kilowatt of power, extreme localized heat density creates significant bottlenecks for compute performance and data center efficiency. Incorporating synthetic diamond into direct-to-chip cooling systems allows hardware providers to cool power densities up to 770 W/cm², enabling high-density AI accelerators to sustain peak throughput. The LiquidJet Diamond builds upon Frore's 3D multi-stage short-loop liquid cold plate design by layering a diamond wafer vapor chamber over high-heat areas. This enhancement targets extreme thermal flux regions of up to 770 W/cm² to prevent thermal throttling under intensive AI model execution.
## BACKGROUND
High-performance GPUs and AI accelerators dissipate massive amounts of energy, creating concentrated areas of elevated temperature called hotspots on the silicon die. Direct-to-chip liquid cooling uses cold plates with fluid microchannels attached directly to processors, while vapor chambers utilize phase-change heat transfer—often accelerated by high-thermal-conductivity materials like diamond—to spread heat rapidly before the fluid carries it away.