First US-Made Nvidia GB300 GPUs Roll Off TSMC Arizona Line
TSMC's Fab 21 in Arizona has successfully manufactured the first batch of Nvidia's GB300 AI GPUs using a 4nm process. However, because the US facility currently lacks advanced packaging capabilities, these chips must still be shipped overseas to other TSMC facilities for CoWoS packaging. This milestone marks a significant step forward in localizing AI chip manufacturing within the United States, reducing reliance on Taiwanese fabrication plants. However, the lack of local advanced packaging highlights a critical bottleneck in achieving a fully domestic semiconductor supply chain. TSMC plans to build two advanced packaging facilities in Arizona to enable complete domestic production of Nvidia's Blackwell and Rubin architectures. Additionally, TSMC aims to bring its advanced N2 (2nm) and A16 (1.6nm) process technologies to the US by 2028.
## BACKGROUND
CoWoS (Chip-on-Wafer-on-Substrate) is TSMC's proprietary 2.5D advanced packaging technology that integrates processing units like GPUs with High Bandwidth Memory (HBM) using silicon interposers. SoIC (System-on-Integrated-Chips) is a 3D stacking technology that allows different chip functions and nodes to be bonded directly, offering high-bandwidth and low-latency connections.