Enflame and Advanced Packaging Unveil China's First Glass Substrate CoPoS Sample
Enflame and Advanced Packaging have jointly unveiled China's first glass substrate CoPoS advanced packaging sample designed for AI computing chips at WAIC 2026. This marks the first integration of Enflame's self-developed high-end AI chips with domestic CoPoS packaging technology. This development represents a significant step forward in China's domestic semiconductor packaging capabilities, showcasing progress in next-generation glass substrate technology which is crucial for high-performance AI hardware. The sample integrates various advanced processes including physical vapor deposition (PVD), panel-level redistribution layer (RDL), and warpage-controlled low-stress molding. However, the technology is currently in the sample stage and has not yet reached mass production.
## BACKGROUND
Advanced packaging technologies like CoWoS are essential for combining multiple silicon dies, such as GPUs and high-bandwidth memory (HBM), into a single high-performance chip. Glass substrates are emerging as a promising alternative to traditional substrates due to their superior flatness and electrical performance, which are critical for next-generation chiplet-based systems.