Coherent Samples 300mm High-Thermal-Conductivity SiC Substrates for AI Chip Cooling
Coherent has begun sampling 300mm (12-inch) high-thermal-conductivity silicon carbide (SiC) substrates to its AI semiconductor partners. These new substrates are designed to improve heat dissipation by up to 25% compared to existing solutions. As AI processors grow more powerful, thermal management has become a critical bottleneck for next-generation hardware performance. This development could significantly enhance the cooling efficiency and reliability of high-density AI chips and infrastructure. The 300mm SiC substrates are targeted at advanced packaging and heat spreader applications, leveraging SiC's high thermal conductivity, mechanical strength, and thermal stability. Coherent is utilizing its scalable 300mm manufacturing platform to produce these materials.
## BACKGROUND
Silicon carbide (SiC) is a compound semiconductor widely used in power electronics due to its ability to handle high voltages and temperatures. In advanced semiconductor packaging, SiC is increasingly adopted for heat spreaders because its superior thermal properties help draw heat away from densely packed, high-performance processor dies.