China Launches Its First 3D Advanced Semiconductor Packaging Mass Production Line
Hubei Xingchen Technology launched Phase II of its advanced packaging platform in Wuhan Optics Valley, establishing China's first 3D advanced packaging mass production line. Representing a total combined investment of over 7 billion RMB, the Phase II line achieved operational status in 11 months and integrates both 2.5D and 3D packaging capabilities. This project represents a critical step forward in China's strategy to build a self-reliant semiconductor supply chain for high-performance AI compute chips. Achieving domestic 2.5D and 3D packaging capabilities reduces reliance on overseas foundries for advanced chiplet integration and next-generation optoelectronic systems. The newly completed line can simultaneously support pilot and risk production runs for 40 to 50 chip designs, while validating 30 to 40 sets of domestic semiconductor equipment and materials. Its capabilities target key application domains including high-performance AI computing, smart terminals, integrated sensing-memory-computing chips, and optoelectronic integration.
## BACKGROUND
Advanced semiconductor packaging has become vital for boosting microchip performance as traditional silicon miniaturization reaches physical limits. While 2.5D packaging places multiple dies side-by-side on an interposer substrate, 3D packaging vertically stacks chip dies directly on top of one another to significantly increase interconnect density and data transfer speeds.