Banks and Blackstone Raise $60 Billion Debt Package for Broadcom AI Chip Procurement

A syndicate of Wall Street banks and Blackstone are raising a $60 billion debt package to fund the procurement of Broadcom AI chips and infrastructure for companies like Anthropic. The deal consists of $42 billion in Class A senior secured debt and $18 billion in Class B subordinated debt led by Blackstone. This massive debt structure demonstrates how financial markets are evolving to finance the immense hardware demands of generative AI. It aids Broadcom in expanding its custom AI chip business to challenge Nvidia while providing AI firms like Anthropic access to vital compute capacity. Blackstone has committed $9 billion directly from its funds toward the $18 billion Class B tranche, planning to syndicate the remainder to other institutional investors. This effort reflects a growing industry trend where hardware vendors work with private capital giants to offer equipment financing for buyers.