Anthropic Seeks SK Hynix Memory Supply for Custom AI Chips
SK Group Chairman Chey Tae-won revealed that AI startup Anthropic has approached SK Hynix to secure memory chips for its custom AI hardware project. This follows reports that Anthropic has initiated early development of its own AI chips and is in talks with Samsung Electronics for manufacturing. Anthropic's move to design custom silicon highlights a growing industry trend where major AI labs seek to reduce their reliance on Nvidia's dominant GPUs. Securing high-performance memory from SK Hynix is crucial for building competitive AI accelerators capable of handling massive workloads. Anthropic is reportedly exploring Samsung's 2nm foundry process and advanced packaging technologies for its custom chip project. SK Hynix is a dominant player in High Bandwidth Memory (HBM), which is essential for powering modern AI processors.
## BACKGROUND
High Bandwidth Memory (HBM) is a 3D-stacked memory architecture that provides massive data throughput, solving critical bottlenecks for AI accelerators. Advanced packaging is a semiconductor manufacturing technique that integrates multiple dies or chiplets, such as logic processors and HBM, into a single high-performance device.