Amkor Invests 3 Trillion KRW to Boost Advanced Packaging in South Korea
OSAT giant Amkor held a ground-breaking ceremony for an expansion project at its Gwangju plant in South Korea, committing 3 trillion KRW over the next five years. The project is designed to serve the advanced packaging demands of AI and HPC chips. This major corporate investment highlights the ongoing hardware infrastructure expansion needed to support the rapidly growing global AI and high-performance computing supply chains. It reinforces South Korea's strategic importance in advanced semiconductor manufacturing and post-processing. The expansion will create 3,000 jobs, with the first two plants slated for completion in the second half of 2027 and another two in the first half of 2028 before entering mass production. Amkor previously began constructing an advanced test facility in Incheon late last year.
## BACKGROUND
OSAT (Outsourced Semiconductor Assembly and Test) companies specialize in third-party services for packaging integrated circuits and conducting reliability tests after the wafer fabrication process. Advanced packaging integrates multiple components or dies into a single package to enhance performance and power efficiency beyond traditional single-die packaging limitations.