AMD Previews Next-Gen Zen 6 Verano EPYC Processors with LPDDR5X Support
AMD previewed its next-generation Verano EPYC data center processors at the OCP Global Summit, scheduled for a 2027 release. Built on the Zen 6 architecture, these processors introduce LPDDR5X memory support via SOCAMM2 modules to power agentic AI workloads. This roadmap update addresses the surging host-side memory and compute demands of agentic AI workloads in data centers. By pairing high-performance CPU cores with power-efficient LPDDR5X and modular server memory, AMD aims to significantly improve rack-level energy efficiency and system performance. The Verano processors are designed to act as host nodes for future AMD Instinct GPUs, utilizing xGMI interconnect speeds of up to 112 Gbps. While early reports indicate configurations ranging up to 72 or 192 Zen 6 cores paired with a 24-channel LPDDR5X memory subsystem, official full specifications remain pending.
## BACKGROUND
Verano is part of AMD's upcoming Zen 6 processor family codenamed 'Venice' and 'Verano' for servers, leveraging advanced manufacturing nodes. SOCAMM2 represents an evolution of the CAMM memory form factor standardized by JEDEC, engineered specifically for high-performance server environments with low power consumption.