AMD CEO Lisa Su Reportedly Visiting South Korea to Discuss Samsung HBM4 AI Memory Partnership
AMD CEO Lisa Su is reportedly traveling to South Korea next month to meet with Samsung Electronics executives regarding AI chips and potential HBM4 memory supply agreements. During her visit, she is also expected to meet with executives from local South Korean Neural Processing Unit (NPU) startups. Securing a reliable supply of next-generation HBM4 memory is critical for AMD as it competes with Nvidia in the expanding AI accelerator market. Strengthening ties with Samsung could help AMD stabilize its supply chain and meet the rapidly growing demand for high-performance AI hardware. This upcoming visit follows a Memorandum of Understanding (MOU) signed between AMD and Samsung in March focusing on AI memory and computing technologies. Reports indicate Samsung is positioned as a preferred supplier of HBM4 memory chips for AMD's future AI accelerators.
## BACKGROUND
High Bandwidth Memory (HBM) is a 3D-stacked SDRAM architecture essential for delivering the extreme memory bandwidth required by modern AI processors, with HBM4 being its next-generation standard. Neural Processing Units (NPUs) are specialized hardware accelerators designed specifically to handle AI and machine learning workloads efficiently.