AMD CEO Lisa Su Meets Samsung Semiconductor Head Over Memory Shortages
AMD CEO Lisa Su is visiting Seoul to meet with Samsung Electronics semiconductor chief Jun Young-hyun to discuss securing memory chip supplies amid ongoing global shortages. This marks her second visit to South Korea in seven months, following a supply agreement reached between the two companies in March. Persistent shortages and surging prices of high-bandwidth memory (HBM) have become a major bottleneck for expanding AI infrastructure and data center capabilities. Securing a reliable supply chain for next-generation HBM is essential for AMD to maintain its competitiveness in the booming AI hardware market. The discussions focus on next-generation HBM and advanced memory chips under an agreement originally struck in March. Meanwhile, South Korea is spearheading an $880 billion domestic push across tech giants including Samsung and SK Hynix to build out AI digital infrastructure.
## BACKGROUND
High Bandwidth Memory (HBM) is an advanced memory architecture that vertically stacks dynamic random-access memory (DRAM) chips using Through-Silicon Vias (TSVs) to provide vastly higher data transfer speeds for complex computational workloads. Because modern AI hardware requires immense memory bandwidth, demand for HBM from top manufacturers like Samsung and SK Hynix has strained global production capacity.