AI Server Demand Projected to Drive 260% Surge in High-End Copper Foil by 2026
Driven by the rapid growth of AI computing, the demand for specialized high-end copper foil for AI servers is projected to reach approximately 24,000 tons by 2026, representing a 260% increase. High-performance AI servers require 15 to 30 kg of copper per unit, which is 3 to 6 times the amount used in standard servers. This surge highlights how the AI boom is impacting physical infrastructure and raw material supply chains, particularly for cooling systems and high-speed data transmission. The shift toward high-performance hardware is driving up prices and processing fees for specialized copper components like ultra-low profile foils. Ultra-low profile copper foil (HVLP) with a surface roughness under 2 microns can increase signal transmission rates by 70% compared to traditional copper foil by reducing signal attenuation. Additionally, the adoption of liquid cooling has increased the use of copper in thermal components like liquid cooling plates.
## BACKGROUND
High-speed printed circuit boards (PCBs) in AI servers require materials that minimize signal loss at high frequencies. In high-frequency transmission, the "skin effect" causes electrical current to flow primarily on the outer surface of a conductor, making the surface roughness of the copper foil a critical factor in signal attenuation.