满足英伟达等公司 AI 芯片需求，消息称台积电扩大 CoW 封装外包规模
TSMC is reportedly expanding the outsourcing of its CoW (Chip-on-Wafer) packaging process to OSATs like ASE to alleviate CoWoS capacity bottlenecks and meet surging AI chip demand.
TSMC is reportedly expanding the outsourcing of its CoW (Chip-on-Wafer) packaging process to OSATs like ASE to alleviate CoWoS capacity bottlenecks and meet surging AI chip demand.
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